0.1mm 2" Cu10W90 Silicon-based Ultra High Brigtness LED Chip Thermoelectric Cooling Base
Surface Condition:Polishing and Grounding
Surface Roughness: 0.03um, Mirror Surface;
Surface: Ni/Au Coating.
Standard of Plating:
Withstand 500 degrees baking verification by 15 minutes.
Withstand 3M adhesive tape test after scribe the surface to 1x1mm space.
Uniformity of coating thickness: within +/-15%.
No peeling, bubbles, delamination, water stains, dents; No visible scratches; Uniform color
Surface Roughness changes within 0.01um after plating.
Gold Purity: 99.99%
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