0.15Tmm 4 Inch 90WCu Thermal Mounting Plate for Blue led chip Sub-mounts Heat Base
Surface Condition:Polishing and Grounding
Surface Roughness: 0.03um, Mirror Surface;
Surface: Without Coating.
- 0.1mm 4 Inch Moly Heat Submount For Vertical High Power Red LED Chip Thermal Management
- 0.004" Thickness 2" Moly Heat Base For Vertical High Power Red LED Chip Thermal Management
- 2" 15cu85W (Tungsten and Copper Alloy) Heat Sinks For Production of Blue LED Bare Chip
- Sh Raremetal Provide World-Class Foil Products! We Are Not Plansee!we Are Not Sumitomo!
- 89 and 84 Tungsten Copper (Wcu) Sheet Type Substrate For High Power LED Module
- Related Searches