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Semiconductor Thermal Management

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Mocu Substrate For Semiconductor Heat Sink 2014-12-29
· High thermal conductivity · Excellent hermeticity · Excellent flatness, surface finish, and size control · Semi-finished or finished (Ni/Au plated) pro
 
Wcu Heat Sink Substrate For Semiconductor Packaging 2014-12-29
Size: 0.04~50*Max.500*Max.300 Tungsten Copper Heat Sinks Advantages · High thermal conductivity · Excellent hermeticity · Excellent flatness, surface fin
 
Pure Molybdenum Disc For Electronic Component 2014-12-29
Material: 99.95% pure molybdenum Thickness: Min.0.01mm Dia: 10-600mm We can also produce molybdenum slice at other different shapes per customer’s drawing.
 
Tantalum Foil 2014-12-29
Tantalum Foil: (cold rolled, annealed) Thickness: minimum 0.02 mm (20 μm) Width and length: 500 mm or cut to size Standard: ASTM B708 UNS R05252 Ta-2.5W
 
Tungsten Electrode 2014-12-29
Tungsten electrode is used for TIG welding, which is produced by mixing rare earth element such as Cerium, thorium, lanthanum, zirconium, yttrium of about 0.3%
 
Tungsten Foil and Sheet 2014-12-29
Grade: W1,W2 Specifications: Thickness: 0.03-6.00 mm Width max: 800 mm Length: 500-2300 mm Standard: ASTM B760
 
Zirconium Wire 2014-12-29
Zirconium wire we manufacture: Hot rolling, cold drawning, annealing, redrawing, Hammering, Pressing, Rolling Diameter: minimum 0.03 mm-10 mm, 4 Gauge- 44
 
1T and 2T High Purity Titanium Disk For Semiconductor 2014-12-26
1T and 2T High Purity Titanium Disk for Semiconductor Thickness: 1T/2T Diameter: 710 mm SH-RareMetal manufacturing with refractory metal & its alloys
 
Diode Laser Thermal Management Mo60cu Heat Sink Block. Internal Thermo-Electric Cooler! 2014-12-26
DIODE LASER THERMAL MANAGEMENT Mo60Cu Heat Sink Block. Internal Thermo-Electric Cooler! 1. Material: Mo60Cu 2. Size: 1.7 x 4.4 x 6.5 mm 3.Thermal Cond
 
Astm B 760 0.02mm Thickness Ultrathin Pure Tungsten Foil 2014-12-26
ASTM B 760 0.02mm Thickness Ultrathin Pure Tungsten Foil Thickness: 0.02mm Shape: Square. Welcome check with barbara at sh-raremetal dot com for your
 
0.1mm High Hardness Tungsten Alloy Metal Vibration Parts For Loudspeaker 2014-12-26
0.1mm High Hardness Tungsten Alloy Metal Vibration Parts for loudspeaker, Density at 17/18 Thickness: 0.1~0.3mm per customer needs. Width:
 
High Temperature Molybdenum Lanthanum Alloy Utensil and Boat 2014-12-26
High Temperature Molybdenum Lanthanum Alloy Utensil and Boat Material: Molybdenum-lanthanum alloy (0.7% La2O3), mainly used to produce sheet and plate. D
 
Long Lifespan High Melting Point Molybdenum Arc Chamber For Semiconductor Implanter 2014-12-26
Long Lifespan High Melting Point Molybdenum Arc Chamber for Semiconductor Implanter Material:Pure Molybdenum/ Tungsten Melting Point of Molybdenum: 2610
 
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