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LED Heat Sink

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0.1mm 4 Inch Moly Heat Submount For Vertical High Power Red LED Chip Thermal Management 2015-02-02
0.1mm 4 Inch Moly Heat Submount for Vertical High Power Red LED Chip Thermal Management 1. Material: Pure Molybdenum 2. Thickness: 0.
 
0.004" Thickness 2" Moly Heat Base For Vertical High Power Red LED Chip Thermal Management 2015-01-07
0.004" Thickness 2" Moly Heat Base for Vertical High Power Red LED Chip Thermal Management 1. Material: Pure Molybdenum 2. Thickness: 0.1mm;0.004" 3.
 
2" 15cu85W (Tungsten and Copper Alloy) Heat Sinks For Production of Blue LED Bare Chip 2015-01-07
2" 15Cu85W (Tungsten and Copper Alloy) Heat Sinks for Production of Blue LED Bare Chip 1. Material: 20CuW,15CuW,11CuW (company also provide other materi
 
Sh Raremetal Provide World-Class Foil Products! We Are Not Plansee!we Are Not Sumitomo! 2015-01-07
SH RareMetal Provide World-Class Foil products! We are not Plansee! We are not Sumitomo! Yes! We are not Plansee! We are not Sumitomo! We are SH-RareMetal!
 
89 and 84 Tungsten Copper (Wcu) Sheet Type Substrate For High Power LED Module 2015-01-07
89 and 84 Tungsten Copper (WCu) Sheet Type Substrate for High Power LED Module 1. Material: 89WCu, 84WCu 2. Size: 0.12 x 120 x 120 mm 0.18~0.23x
 
3" 15cu85W High Thermal Conductivity Heat Substrate For Sapphire Based LED Chips 2015-01-07
3" 15Cu85W High Thermal Conductivity Heat Substrate for Sapphire Based LED Chips 1. Material: 20CuW,15CuW,11CuW (company also provide other material like Cu
 
Leading Supplier of 6" 15cuw Tungsten Copper Heat Base For Sapphire LED Chip 2015-01-07
Leading Supplier of 6" 15CuW Tungsten Copper Heat Base for Sapphire LED Chip 1. Material: 20CuW,15CuW,11CuW (company also provide other material like CuMo a
 
0.2mm 6" 90wcu (Tungsten Copper) LED Heat Sink Substrate 2015-01-07
0.2mm 6" 90WCu (Tungsten Copper) LED Heat Sink Substrate 1. Material: 90WCu (company also provide other material like CuMo and pure Mo wafer) Can be Ni.A
 
0.15tmm 4" Cu11-W89 Coated Uhb Vertical LED Chip Cooling Base 2015-01-07
0.15Tmm 4" Cu11-W89 Coated UHB Vertical LED Chip Cooling Base. Made In Shanghai, China! Material: 11Cu89W Thickness: 0.15mm Size: 4" Surface Condit
 
0.1mm 2" Cu10W90 Silicon-Based Ultra High Brigtness LED Chip Thermoelectric Cooling Base 2015-01-07
0.1mm 2" Cu10W90 Silicon-based Ultra High Brigtness LED Chip Thermoelectric Cooling Base Material: 10Cu90W Thickness: 0.1mm Size: 2" Surface Condit
 
0.2mm 6" Cu11-W90 Vertical LED Epitaxial Wafer Miniature Thermoelectric Heat Cooling Metal 2015-01-07
0.2mm 6" Cu11-W90 Vertical LED Epitaxial Wafer Miniature Thermoelectric Heat Cooling Metal Material: 11Cu89W Thickness: 0.2mm Size: 6" Surface Cond
 
0.15tmm 4 Inch 90wcu Thermal Mounting Plate For Blue LED Chip Sub-Mounts Heat Base 2015-01-07
0.15Tmm 4 Inch 90WCu Thermal Mounting Plate for Blue LED Chip Sub-mounts Heat Base Material: 11Cu89W Thickness: 0.15mm Size: 4" Surface Condition:P
 
0.2tmm 2" 11cu89W (Copper Tungsten) Heat Base For Sapphire-Based High Brightness LED Chips 2015-01-07
0.2Tmm 2" 11Cu89W (Copper Tungsten) Heat Base for Sapphire-based High Brightness LED Chips Material: 11Cu89W Thickness: 0.2mm Size: 2" Surface Cond
 
Plated 0.1tmm 4" 3N7 Molybdenum Thermal Mounting Base For GaAs-Basd LED Red Chip Heat Sink 2015-01-07
Material: Pure Molybdenum Thickness: 0.1mm Size: 4" Surface Condition:Polishing and Grounding Surface Roughness: 0.03um, Mirror Surface; Coatin
 
Plated 0.15tmm 4" Mirror Type Moly Internal Thermo-Electric Cooler For LED Red Die 2015-01-07
Material: Pure Molybdenum Thickness: 0.15mm Size: 4" Surface Condition:Polishing and Grounding Surface Roughness: 0.03um, Mirror Surface; Coat
 
W, Mo Foil and Sheet 2014-12-29
Product Name: Tungsten Foil and sheet Model: W1, W2 Thickness: 0.03-6.00 mm Width max: 800 mm Length: 500-2300 mm Product Name: Molybd
 
Tungsten Heater For Sapphire Growth Furnaqce 2014-12-29
1 Tungsten heater 1.1 Purity:W≥99.95%; 1.2 Density:≥19.1g/cm3; 1.3 Application temperature environment:≤2300℃; 2 Copper bases 2.1 Purity:Cu≥99
 
Cuw Wafer For LED Heat Sink 2014-12-29
Material: 11Cu89W Thickness: 0.2mm Size: 2" Surface Condition:Polishing and Grounding Surface Roughness: 0.03um, Mirror Surface; Surface: Without Coating.
 
Cumo Wafer For LED Chip Heat Sink 2014-12-29
1. Material: 20CuW,15CuW,11CuW (company also provide other material like CuMo and pure Mo wafer) Can be Ni.Au plated. 2. Size: 2", 3", 4", 5", 6" (other s
 
Powder Metallurgy! Tungsten Copper (Wcu) Meat Substrate For LED Chip Thermal Spray 2014-12-26
1. Material: 90WCu, 85WCu 2. Size: 0.12 x 120 x 120 mm 0.18~0.23x110x110 mm 0.2 x 120 x 120 mm 0.4 x120 x 240 mm ... 3. Thickness: 0.08
 
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