Semi Automatic Bga Rework Station (ZM-R6200)
Model Number: ZM-R6200 | |
Country of Origin: China | |
Brand Name: JKW | |
Minimum Order:1 set | |
Price/Payment: EXW, TT, FOB, CIF, CRF | |
Production Capacity: 50000 pcs/year sets | |
Semi Automatic Bga Rework Station
Product Specifications/Features
-
Top / bottom nozzle are hot air heating. The bottom plates are infrared to preheat the PCB;
Top and bottom 3 heating to run 3 temperature curves on touch panel
Different nozzle size available, magnetic installation, 360°rotation.
Rework double BGA, CCGA, QFN, CSP, LGA, SMD etc.
External sensor socket to detected temperature for industrial analysis.
>> Optical Alignment System
CCD optical alignment system+ LCD, smd components to enlarge to Max 230 times, mounting accuracy +/-0.01mm, PCB boards and chip angel micro adjustment, zoom out/in, video shown on 15” HD monitor.
>> Multi-function control system
Touch panel interface, k-type thermocouple, close-loop control, inside Intelligent temperature compensation system. Automatically identify the distance of suction and mounting. with automatic soldering and desoldering functions. the temperature can be set to 6 segment with constant temperature control, 50 groups settings of storage named and saved;
>> Safety system
Alarming when finish desoldering and soldering,
Over heat intelligent power off protection.
Administration interface with password input.
Features;
A; 3 independent heating system
Top and bottom hot-air heaters. Large IR bottom preheating, software or manual controlling top heater or bottom heater. External sensor socket precisely detect temperature, instant temperature curve analyzing.
B; Precise optical alignment system
Optical alignment system and clear images, components can be enlarged up to Maximum 230 times, mounting accuracy +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, 12" HD monitor.
C; Multi-function operation system
Touch screen, k-type thermocouple, close-loop control, intelligent automatic temperature compensation system, top heater and sucker point integrated. Automatic soldering and desoldering. 6 heating stages, N groups of temperature parameters can be saved.
D; Superior safety functions
Alarming after desoldering and soldering, double temperature protection function. Password avoid arbitrary parameter changes. Superior safe protections such as emergency stop, auto power off.
Specifications& technical parameters:
1 |
Total power |
4800W Max |
2 |
Upper hot air heater |
800W (1st heater) |
3 |
Bottom hot air heater |
1200W (2nd heater) |
4 |
IR heater |
2700W (3rd heater) |
5 |
Power supply |
AC 220V±10 50/60Hz |
6 |
Electrical materials |
Touch panel + temperature module + PLC |
7 |
Dimensions |
640×630×900mm |
8 |
Temperature control |
K-type thermocouple (Closed Loop), |
9 |
PCB Positioning |
V -groove, external universal fixture |
9 |
P C B size |
Max 410×370mm; Min65×65mm |
10 |
Available BGA chip |
1×1~ 80×80mm |
11 |
Net weight |
65kg |
80mmx80mm/90mmx90mm bga reballing station
219pcs/set universal stencils(80mmx80mm/90mmx90mm)
7pcs/set 25K leaded solder balls
Amech559 100g solder paste
desoldering wick(CP-3015)
Magnifier
kapton tape(20mmx40m)
vaccum suction pen(FFQ939)
antistatic tweezer
antistatic brush
scraper
- Packing: 640*630*900 mm
- Shipping: By sea, by DHL, by air
- Standard: CE, ROHS
Didn't find what you're looking for? Post a Buy Offer
Send inquiry directly to this supplier
More products from this companyFind More Products
- Profound 0.25mm/0.3mm/0.35mm/0.4mm/0.45mm/0.5mm/0.55mm/0.6mm/0.65mm/0.76mm Leaded Bga Solder Ball
- Zm-R255 Bga Chip Welding Machine
- SMD Chip Counter
- Kic Explorer Thermal Profiler Temperature Inspection
- Programmable DC Electronic Load
Find Similar Products By Category
- Related Searches
You may also be interested in: