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Semi Automatic Bga Rework Station (ZM-R6200)

Model Number: ZM-R6200
Country of Origin: China
Brand Name: JKW
Minimum Order:1 set
Price/Payment: EXW, TT, FOB, CIF, CRF
Production Capacity: 50000 pcs/year sets
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Semi Automatic Bga Rework Station

Product Specifications/Features
    Top / bottom nozzle are hot air heating. The bottom plates are infrared to preheat the PCB;

    Top and bottom 3 heating to run 3 temperature curves on touch panel

    Different nozzle size available, magnetic installation, 360°rotation.

    Rework double BGA, CCGA, QFN, CSP, LGA, SMD etc.

    External sensor socket to detected temperature for industrial analysis.



    >> Optical Alignment System

    CCD optical alignment system+ LCD, smd components to enlarge to Max 230 times, mounting accuracy +/-0.01mm, PCB boards and chip angel micro adjustment, zoom out/in, video shown on 15” HD monitor.



    >> Multi-function control system

    Touch panel interface, k-type thermocouple, close-loop control, inside Intelligent temperature compensation system. Automatically identify the distance of suction and mounting. with automatic soldering and desoldering functions. the temperature can be set to 6 segment with constant temperature control, 50 groups settings of storage named and saved;



    >> Safety system

    Alarming when finish desoldering and soldering,

    Over heat intelligent power off protection.

    Administration interface with password input.


    Features;

    A; 3 independent heating system
    Top and bottom hot-air heaters. Large IR bottom preheating, software or manual controlling top heater or bottom heater. External sensor socket precisely detect temperature, instant temperature curve analyzing.

    B; Precise optical alignment system
    Optical alignment system and clear images, components can be enlarged up to Maximum 230 times, mounting accuracy +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, 12" HD monitor.

    C; Multi-function operation system
    Touch screen, k-type thermocouple, close-loop control, intelligent automatic temperature compensation system, top heater and sucker point integrated. Automatic soldering and desoldering. 6 heating stages, N groups of temperature parameters can be saved.

    D; Superior safety functions
    Alarming after desoldering and soldering, double temperature protection function. Password avoid arbitrary parameter changes. Superior safe protections such as emergency stop, auto power off.

    Specifications& technical parameters:

    1

    Total power

    4800W  Max

    2

    Upper hot air heater

    800W   (1st heater)

    3

    Bottom hot air heater

    1200W  (2nd heater)

    4

    IR heater

    2700W   (3rd heater)

    5

    Power supply

    AC 220V±10    50/60Hz

    6

    Electrical materials

    Touch panel + temperature module + PLC

    7

    Dimensions

    640×630×900mm

    8

    Temperature control

    K-type thermocouple (Closed Loop),

    9

    PCB Positioning

    -groove, external universal fixture

    9

    P C B size

    Max 410×370mm;  Min65×65mm

    10

    Available BGA chip

    1×1~ 80×80mm

    11

    Net weight

    65kg

     

    80mmx80mm/90mmx90mm bga reballing station
     
     
    219pcs/set universal stencils(80mmx80mm/90mmx90mm)
     
    7pcs/set 25K leaded solder balls
     
    Amech559 100g solder paste
     
    desoldering wick(CP-3015)
     
    Magnifier
     
    kapton tape(20mmx40m)
     
    vaccum suction pen(FFQ939)
     
    antistatic tweezer
     
    antistatic brush
    scraper
     
     

     

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Alan zhong
Mr. Alan zhong
 
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