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0.1mm 4 Inch Moly Heat Submount For Vertical High Power Red LED Chip Thermal Management

Country of Origin: China (Mainland)
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0.1mm 4 Inch Moly Heat Submount For Vertical High Power Red LED Chip Thermal Management

Product Specifications/Features

    0.1mm 4 Inch Moly Heat Submount for Vertical High Power Red led chip Thermal Management

    1. Material: Pure Molybdenum 

    2. Thickness: 0.1mm;0.004"
    3. Size: 4"

    4. Surface Condition:Polishing and Grounding

    5. Surface Roughness: 0.03um, Mirror Surface; <0.1um

    6. Surface: Without Coating.

    0.1mm 4 Inch Moly Heat Submount for Vertical High Power Red LED Chip Thermal Management

     

    0.1mm 4 Inch Moly Heat Submount for Vertical High Power Red LED Chip Thermal Management

    0.1mm 4 Inch Moly Heat Submount for Vertical High Power Red LED Chip Thermal Management

    Shanghai Rare Metal Foil Capability:

    Our capability on pure Mo. Foil: Min. 0.01mm

    Our capability on pure W. Foil: Min. 0.02mm

    Our capability on W alloy. Foil: Min. 0.02mm

    Our capability on WCu Foil: Min. 0.04mm

    Our capability on MoCu Foil: Min. 0.025mm

    Our capability on Ti. Foil: Min. 0.01mm

    Our capability on Ta. Foil: Min. 0.01mm

     

    4. Application: 

    Blue LED Chip; Red LED Die; 

    LED Bare Chip; LED COB Package; 

    High-Brightness LED; High-Power LED; Vertical LED;

    Sapphire Substrate Bonding; GaAs Substrate Carrier; 

     

    Most of the engineers in Shanghai Rare Metal Advanced Materials Co., Ltd has more than 30 years experience 

    in rare metal field, plus our production patent and process technology, we have confidence to announce: 

    ONLY UNEXPECTED, NOT IMPOSSIBLE!

     

    Welcome check with us for your rare metal needs!

     

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Barbara Zeng
Ms. Barbara Zeng
 
From: barbara@sh-raremetal.com(Not you?)

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