0.1mm 4 Inch Moly Heat Submount for Vertical High Power Red led chip Thermal Management
1. Material: Pure Molybdenum
2. Thickness: 0.1mm;0.004"
3. Size: 4"
4. Surface Condition:Polishing and Grounding
5. Surface Roughness: 0.03um, Mirror Surface; <0.1um
6. Surface: Without Coating.
Shanghai Rare Metal Foil Capability:
Our capability on pure Mo. Foil: Min. 0.01mm
Our capability on pure W. Foil: Min. 0.02mm
Our capability on W alloy. Foil: Min. 0.02mm
Our capability on WCu Foil: Min. 0.04mm
Our capability on MoCu Foil: Min. 0.025mm
Our capability on Ti. Foil: Min. 0.01mm
Our capability on Ta. Foil: Min. 0.01mm
Blue LED Chip; Red LED Die;
LED Bare Chip; LED COB Package;
High-Brightness LED; High-Power LED; Vertical LED;
Sapphire Substrate Bonding; GaAs Substrate Carrier;
Most of the engineers in Shanghai Rare Metal Advanced Materials Co., Ltd has more than 30 years experience
in rare metal field, plus our production patent and process technology, we have confidence to announce:
ONLY UNEXPECTED, NOT IMPOSSIBLE!
Welcome check with us for your rare metal needs!
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